MG Chemicals Non-Silicone Epoxy Mold Release, 12.3 oz Aerosol (8329-35 –  Electronix Express

MG Chemicals Non-Silicone Epoxy Mold Release, 12.3 oz Aerosol (8329-35 – Electronix Express

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Description

Description Description The 8329 Epoxy Mold Release is a non-silicone release agent that is formulated to prevent epoxies and other thermosetting

MG Chemicals Non-Silicone Epoxy Mold Release, 12.3 oz Aerosol (8329-350G)

Silver Epoxy

MG Chemicals 8331S Silver Epoxy Adhesive - High Conductivity, 4 hr. Working time, 15 g, 2 Dispeners (8331S-15G): : Industrial & Scientific

Non-Silicone Mold Release Agent

The 8329 Epoxy Mold Release is a non-silicone release agent that is formulated to prevent epoxies and other thermosetting materials from bonding to metal molds. This release agent was developed specifically for transfer and compression molding. It can be safely used on most types of plastic. It is very efficient at fully penetrating molds and forming a thin, even coat across the mold surfaces. This ensures a clean part release and glossy finish.

mg Chemicals Non-Silicone Epoxy Mold Release 12.3 oz Aerosol

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Epoxy Resin Mold Release TR 104 Hi-Temp - Superclear Epoxy Resin Systems

MG Chemicals 8329-350G Non-Silicone Epoxy Mold Release, 12.3 oz Aerosol: Epoxy Adhesives: : Industrial & Scientific

MG Chemicals # 8329-350G (12.3oz) Non-Silicone Epoxy Mold Release – MarVac Electronics

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MG Chemicals 8329-350G Non-Silicone Epoxy Mold Release, 12.3 oz Aerosol: Epoxy Adhesives: : Industrial & Scientific

Flexible Epoxy

Epoxy Resin Mold Release

This release agent was developed specifically for transfer and compression molding. It can be safely used on most types of plastic. This ensures a

MG Chemicals Non-Silicone Epoxy Mold Release, 12.3 oz Aerosol (8329-350G)

MG Chemicals 8329-350G Non-Silicone Epoxy Mold Release, 12.3 oz Aerosol: Epoxy Adhesives: : Industrial & Scientific