MG Chemicals Thermally Conductive Epoxy Adhesive - Micro Center

MG Chemicals Thermally Conductive Epoxy Adhesive - Micro Center

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Micro Center - MG Chemicals Thermally Conductive Epoxy Adhesive

Excellent electrical and thermal conductivity Easy 1:1 mix ratio Strong water and chemical resistance to brine, acids, bases, and aliphatic

MG Chemicals 832TC-450ML Thermally Conductive Epoxy Encapsulating and Potting Compound, 15 oz Kit, Black

Thermal conductivity of 0. 8 W/(m·K) 1:1 mix ratio Working life: 4 minutes, set time: 15 minutes Cure time: 3 hours at room temperature or 15 minutes

MG Chemicals - 8329TFF-25ML 8329TFF Thermally Conductive Adhesive - Fast Cure Epoxy, 25 mL Dual Dispenser

Catalysts, Free Full-Text

This electrically conductive silver epoxy allows for quick, cold-soldering repairs. It is considered a solder replacement epoxy for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. High electrical conductivity Convenient 1 to 1 mix ratio Cures at room temperature SVHC free Long shelf life.

mg Chemicals 8331D-14G Silver Conductive Epoxy

MG Chemicals 8329TCS Thermal Conductive Adhesive, Slow Cure, 15 g

Thermally Conductive Epoxy Adhesive

Thermal conductivity: 1.36 W/(m·K) Easy 1:1 mix ratio Adheres to most electronic substrates Stores and ships at slightly below room temperature - no

MG Chemicals - 8329TCM-6ML 8329TCM Thermally Conductive Adhesive, Medium Cure, 14 g, 2 Dispensers, 6 mL Kit

Thermally Conductive Epoxy

MG Chemicals Thermally Conductive Epoxy - Micro Center

Size:0.45 Gallon kit Thermally conductive epoxy encapsulating and potting compound. 100 Percent solids. Formulated with undiluted Bis F resin for

MG Chemicals Thermally Conductive Black Epoxy Encapsulating and Potting Compound