Thermal conductive glue with Graphene filler Thal Technologies

G270 is a one-component epoxy with high-thermal conductivity and adhesive strength. As a heat carrier, graphene provides high stability. G270 offers a good adhesive strength, in both metallic as well in plastic materials. G270 is widely used in LED and semiconductors industries for assembly and many other applications.

MgAl Layered Double Oxide/Reduced Graphene Oxide Composites with Reduced Interfacial Thermal Resistance for Thermal Conductivity and Electrical Insulation Applications

Conducting Nanomaterial Sensor Using Natural Receptors

Thermal conductive gap filler Thal Technologies

Self-Assembling Hydrogel Structures for Neural Tissue Repair

MG Chemicals Thermally Conductive Epoxy Adhesive - Micro Center

Thermal Gap Filler Pads Thal Technologies

Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally

G6E-TSHV High Thermally Conductive , Non-Electrically Conductive Epoxy

High thermal conductive Glue Thal Technologies

Laser-induced graphene composite adhesive tape with electro-photo-thermal heating and antimicrobial capabilities - ScienceDirect

Study on Thermal Conductivity and Thermogravimetric Analysis of Glass Fibre Epoxy Resin Composites Modified with Silicon Carbide and Copper Nanoparticles

(PDF) One-step photonic curing of screen-printed conductive Ni flake electrodes for use in flexible electronics

Polymers, Free Full-Text